Neutral flash etching solution "OPC Seed Etchant NE"
Flash etching solution for copper sputter film compatible with fine circuit boards 'OPC Seed Etchant NE'
With the miniaturization, high performance, and high functionality of information and communication devices, semiconductor devices are now required to operate at high speeds. For the implementation of wiring on semiconductor package substrates and printed circuit boards, the method of forming a copper seed layer through sputtering followed by electroplating has become common to achieve further miniaturization and improved interlayer adhesion. Our company has newly developed a flash etching solution that preferentially etches copper sputtered films to accommodate copper sputtered films. There is a demand for technology that reduces transmission loss in copper films to support high-speed communication. To meet this demand, we have newly developed a flash etching solution for copper sputtered films that is optimal for fine circuit substrates and excels in planar smoothness.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
